Twinstar Technology is proud to officially announce its strategic collaboration with ETSC Micro Devices Co., Ltd. based in Tokyo, Japan, to jointly establish and operate an overseas R&D Verification and Validation (V&V) Center dedicated to micro‑optic innovation.

This strategic partnership is tailored to support the rapidly evolving market demand for re‑pluggable micro‑optic components used in Co‑Packaged Optics (CPO) and AI computing engines, two high‑growth sectors driving the next generation of data center and artificial intelligence infrastructure.

The joint V&V Center, located in Tokyo’s high‑tech cluster, will further strengthen the technical ecosystem by integrating advanced testing capabilities, enriching resources for high‑volume production line design, precision process development, and intelligent automation support. By combining Twinstar’s expertise in optical interconnect solutions with ETSC Micro Devices’ local technical advantages in Japan, the collaboration will enhance product reliability, accelerate development cycles, and improve delivery efficiency.