Shanghai Twinstar Technology Co., Ltd. is a Enterprise specializing in the integration of passive and active optical communication technologies. With a 13,000 sqm production base (including 7,000 sqm cleanroom), we are dedicated to providing global customers with internal optical transmission solutions for high-speed optical modules, silicon photonics coupling, and Co-Packaged Optics (CPO) interconnects. As a leading solution provider in the industry, we enable rapid full-cycle delivery from design and prototyping to mass production.

The era of AI-driven high-speed interconnect is here, bringing new challenges in bandwidth, power, and density to data centers.Twinstar is your ideal window to explore the complete interconnection link from photonic chips to optical fiber backbones.

Live Demonstrations:

Repluggable CPO Connectivity

Live demo of replaceable CPO interconnect solutions based on grating couplers and edge couplers, enabling maintainability and flexibility for co-packaged optical engines.

Advanced High-Speed Connectors

Next-generation connectors supporting 1.6T and beyond, featuring excellent signal integrity and density advantages.

High-Density EBC Connectors

Novel expanded beam connectors supporting high-power and polarization-maintaining fibers, providing highly reliable, high-density fiber connectivity for harsh environments.

Booth 4816 is your ideal window into the complete interconnect link—from the photonic chip face to the fiber backbone. Our technical experts will be on-site to discuss your specific application challenges in CPO packaging, thermal management, and high-reliability connectivity.

Event Details:

Exhibition Dates: March 17-19, 2026

Conference Dates: March 15-19, 2026

Venue: Los Angeles Convention Center, USA

Our Booth: 4816

Schedule a Meeting:

Contact us in advance to arrange a technical discussion and secure a dedicated demo session at our booth.